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Current Product Offerings
Designs
- 30 layers
- 3 mil lines
- 4 mil micro vias (laser drill)
- 8:1 aspect ratio
- Blind & Buried vias
- PC Cards 8 layers / 22 mils thick
- Thin core (2.0 mil)
- Buried Capacitance
- Impedance; Designed, Controlled Differential, Rambus
- Edge plating
- Metal core
- Laser Direct Imaging
Finishes
- HASL (horizontal)
- OSP, Entek 106A
- Gold; Selective, Electroplate, Immersion
- Immersion Silver
- Soldermask, LPI
- Photoimageable Nomenclature
- Screened Nomenclature
- Soldermask via plug process
Materials
- FR4: FR404; 150 C Tg FR406; 170 C Tg FR408; 180 C Tg
- Polyimide 240 C Tg
- B/T, Bismaleimide Triazine 180 C Tg
- GETek Epoxy PPO 180 C Tg
- Rogers 4350 >280 C Tg
- Speedboard C 200 C Tg
Under Development Materials and Processes
- Zip Cure
- < 14:1 Aspect Ratio
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