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Untitled Document
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| Materials |
3
Days |
5
Days |
10
Days |
+10
Days |
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Tetrafunctional |
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FR-404
- 150 Tg |
x |
x |
x |
x |
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FR-406
- 170 Tg |
x |
x |
x |
x |
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High
Speed Laminate |
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Rogers
4350 |
x |
x |
x |
x |
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GETEK |
x |
x |
x |
x |
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Gore
Speed Board |
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x |
x |
x |
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Thin
Core Laminate |
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0.004" |
x |
x |
x |
x |
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0.003" |
x |
x |
x |
x |
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0.002DT |
x |
x |
x |
x |
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Buried
Capacitance |
x |
x |
x |
x |
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Copper
Foil |
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HTE
- 100% |
x |
x |
x |
x |
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1/2oz.,
1oz., 2oz. - inners |
x |
x |
x |
x |
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1/4oz.,
1/2oz., 1oz., - Outers |
x |
x |
x |
x |
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2oz.
- Outers |
x |
x |
x |
x |
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Hi
Rel Materials |
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Polymide |
x |
x |
x |
x |
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CTE
Control |
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Metal
Core |
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x |
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Back
to Top
| Packaging |
3
Days |
5
Days |
10
Days |
+10
Days |
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BGA |
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1.50mm,
0.060" Pitch |
x |
x |
x |
x |
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1.25mm,
0.050" Pitch |
x |
x |
x |
x |
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1.00mm,
0.040" Pitch |
x |
x |
x |
x |
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0.80mm,
0.032" Pitch |
x |
x |
x |
x |
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PC
Cards |
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6
Layer, 0.018" |
x |
x |
x |
x |
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8
Layer, 0.022" +0.002" -0.004" |
x |
x |
x |
x |
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Layers |
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2-8
Layers |
x |
x |
x |
x |
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10-14
Layers |
x |
x |
x |
x |
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16-18
Layers |
x |
x |
x |
x |
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20+
Layers |
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x |
x |
x |
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Thickness |
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0.015"
- 0.093" |
x |
x |
x |
x |
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0.094"
- 0.150" |
x |
x |
x |
x |
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Tolerance
± 10% |
x |
x |
x |
x |
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Tolerance
± 7% |
x |
x |
x |
x |
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Back
to Top
| Interconnects
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3
Days |
5
Days |
10
Days |
+10
Days |
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Small
Hole Diameter |
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Mechanically
Drilled 0.0135" |
x |
x |
x |
x |
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Mechanically
Drilled 0.010" |
x |
x |
x |
x |
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Laser
Drill 0.004" <0.8 to 1 aspect ratio |
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x |
x |
x |
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Plated
Copper Vias |
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6.0
to 1 aspect ratio |
x |
x |
x |
x |
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8.0
to 1 aspect ratio |
x |
x |
x |
x |
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Blind
and Buried Vias |
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Sequential B&B |
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x |
x |
x |
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Controlled
Impedance |
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Single
Ended, Differential, Rambus ±
10% |
x |
x |
x |
x |
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Lines
and Spaces |
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Internal
4/4 |
x |
x |
x |
x |
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Internal
3/3 |
x |
x |
x |
x |
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External
5/5 |
x |
x |
x |
x |
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External
4/4 |
x |
x |
x |
x |
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Edge
Plating |
| |
Edge
Plating |
x |
x |
x |
x |
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Back
to Top
| Surface Coatings |
3
Days |
5
Days |
10
Days |
+10
Days |
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HASL |
| |
Horizontal
HASL |
x |
x |
x |
x |
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Organic
Surface Protection |
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Entek
106A |
x |
x |
x |
x |
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Gold |
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Soft
AU, Immersion |
x |
x |
x |
x |
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Fingers |
x |
x |
x |
x |
| |
Hard
AU, Electroplated (OS) |
x |
x |
x |
x |
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Silver |
x |
x |
x |
x |
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Solder
Mask |
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LPISM,
Taiyo |
x |
x |
x |
x |
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0.003"
Dams |
x |
x |
x |
x |
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Taiyo,
black, blue, clear, red |
x |
x |
x |
x |
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LPI
Nomenclature, white |
x |
x |
x |
x |
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Nomenclature,
black, yellow, red |
x |
x |
x |
x |
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